• 晶圓背磨砂輪

Back Grinding Wheels

In IC packing process, the first step is back-grinding. After back-grinding wafers will be cut into small chops, then these chips will be packed to be ICs. It is rather vital to maintain a stable grinding rate and qualified surface. When wafers are ground to be thinner, to keep a good thickness uniformity is very important to get a higher packing yield.


In IC packing process, the first step is back-grinding. After back-grinding wafers will be cut into small chops, then these chips will be packed to be ICs. It is rather vital to maintain a stable grinding rate and qualified surface. When wafers are ground to be thinner, to keep a good thickness uniformity is very important to get a higher packing yield.

 

Application: Back grinding of silicon and compound semiconductor wafers.

 

Features:

  1. Specialized bond design and manufacturing technology guarantee the cutting rate stability.
  2. Excellent grinding wheels self-sharpen ability helps to reduce the risk of wafer breaking.
  3. Accurate graded diamond and strict production management enable customers to get a stable ground surface quality of water.



Grit

D(mm)

W(mm)

X(mm)

H(mm)

#325

(D54/80)

|

#8000

(D2/4)

Ø200

|

Ø400

2~5

5

155

158

190

235

 

Note: we can offer other specifications according to your drawing or sample.

Please indicate the following information when placing a new order.

1 specification

2 quantity

3 other requirements