Resin bond diamond & CBN wheels
Description
Resin bond diamond /CBN wheel as an important grinding method for tough materials had widely used to the process of Tungsten Carbide and hardened steel etc. we have developed several new-style resin bond diamond wheels which have been used successfully to high precision, high efficiency and low-cost processing of semiconductor materials.
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Applied on tool grinding machine, for grinding and form grinding of the carbide tools. |
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D |
W |
X |
H |
Grit size |
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11A2 |
100 |
10 |
3 |
20；19.05 |
D200；400；600 |
Unit: mm
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Applied on tool grinding machine, for grinding and form grinding of the carbide tools. |
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D |
W |
X |
H |
Grit size |
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11C9 |
100 |
8 |
1.5 |
20 |
D200；400；600 |
Unit: mm
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For tool grinding machine, or resharpen the carbide turning tools. |
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D |
W |
X |
V |
H |
Grit size |
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12Y9C |
125 |
8 |
1.5 |
45°；60°；90° |
25 |
D200；400；600 |
Unit: mm
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Applied on surface grinding machine, to grind carbide (use diamond-D) and hardened steels (use CBN-B) |
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D |
T |
X |
H |
Grit size |
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1A1 |
152 |
10 |
3；5 |
31.75 |
D100；D200；B150 |
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172 |
10 |
3；5 |
31.75 |
D100；D200；B150 |
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Unit: mm
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Applied on surface grinding machine, to grind carbide (use diamond-D) and hardened steels (use CBN-B) |
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D |
T |
X |
U |
H |
Grit size |
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14A1 |
152 |
10 |
3；5 |
0.6-8 |
31.75 |
D100；D200；B150 |
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175 |
10 |
3；5 |
0.6-8 |
31.75 |
D100；D200；B150 |
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200 |
10 |
3；5 |
4；8 |
31.75 |
D100；D200；B150 |
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350 |
32 |
5 |
10；15 |
127 |
B150 |
Unit: mm
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Surface grinding of GaAs wafers. |
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D |
X |
U |
L |
H |
Grit size |
|
6A9 |
150 |
3 |
8 |
20 |
M12 |
D2000 |
Unit: mm
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Cutting off tungsten carbide bars. |
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D |
T |
X |
H |
Grit size |
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1A1R |
152 |
1 |
7 |
19.05；31.75 |
D120 |
Note: standard grit size. Others depend on your requests.
Please indicate the following information when placing a new order.
1 specification
2 quantity
3 other requirements