• 陶瓷砂輪

Vitrified bond diamond wheels


Description



Resin bond diamond wheel and metal bond diamond wheel have played a very important role in the working of traditional materials (e.g. stone, TC, hardened steel, glass, etc.).with the rapid growth of semiconductor industry and the development of automatic processing, apparently, they cannot meet all the demands of new technics and precision work to some new materials. CP DIAMOND is always keeping to developing vitrified bond diamond wheels which are used to the semiconductor industry and the motor industry. Now we have many kinds of products which have been successfully applied to many new materials and technics for various customers. Hereunder are our specifications for your reference.

 

D(mm)

T(mm)

X(mm)

H(mm)

Grit size

Application

152

10

5

31.75

D150/B150

 

Split punch, precision machine parts, bearing to target coated by hard layer, etc.

175

10

5

31.75

D150/B150

300-600

15-40

5

127

B150

660

50

5-10

205

D300

Hard coated layer grinding of parts such as injection machine charging ram



 

D(mm)

W(mm)

X(mm)

H(mm)

Grit size

Application

150

3-20

5-10

40

D200-1200

Diamond & PCD lathe tools

150

3-10

5-10

M12*1.75

D300-3000

GaAs & sapphire

254

4

8+1

155

D300-3000

Recycle of silicon wafers



 

D(mm)

W(mm)

X(mm)

H/T(mm)

Grit size

Application

125

8

4

31.75/35

D300/600

PCD lathe tools



Note: standard grit size. Others depend on your requests.

Please indicate the following information when placing a new order.

1 specification

2 quantity

3 other requirements