Diamond Grinding Wheels For LED Wafers
Description
The common LED wafers are made of GaAs or sapphire crystal, the thinning process needs many diamond wheels. The ground surface of wafers should be smooth and have no any crack, the parallelism between two surfaces of wafers must be very high. We have developed many kinds of diamond wheels for grinding of LED wafers by the cooperation with our customers.
Specifications
|
Bond |
Shape |
D(mm) |
W(mm) |
X(mm) |
H(mm) |
Grit |
Application |
|
Vitrified Metal |
6A2 |
150 |
3-10 |
5-10 |
M12x1.75 |
D300-3000 |
Sapphire/GaAs |
|
6A9S |
254 |
4 |
8+1 |
155 |
D300-3000 |
Recycling of wafers |
|
|
6A9S |
254 |
3-4 |
10+2 |
155 |
D300-400 |
Sapphire |
Surface grinding of GaAs wafers.
|
Bond |
Shape |
D(mm) |
X(mm) |
U(mm) |
L(mm) |
H(mm) |
Grit |
|
Resin |
6A9 |
150 |
3 |
8 |
20 |
M12 |
D400-D2000 |
Note: we can offer other specifications according to your drawing or sample.
Please indicate the following information when placing a new order.
1 specification
2 quantity
3 other requirements