• LED基板研磨砂輪

Diamond Grinding Wheels For LED Wafers

The common LED wafers are made of GaAs or sapphire crystal, the thinning process needs many diamond wheels. The ground surface of wafers should be smooth and have no any crack, the parallelism between two surfaces of wafers must be very high. We have developed many kinds of diamond wheels for grinding of LED wafers by the cooperation with our customers.


The common LED wafers are made of GaAs or sapphire crystal, the thinning process needs many diamond wheels. The ground surface of wafers should be smooth and have no any crack, the parallelism between two surfaces of wafers must be very high. We have developed many kinds of diamond wheels for grinding of LED wafers by the cooperation with our customers.

 

Specifications



 

Bond

Shape

D(mm)

W(mm)

X(mm)

H(mm)

Grit

Application

Vitrified

Metal

6A2

150

3-10

5-10

M12x1.75

D300-3000

Sapphire/GaAs

6A9S

254

4

8+1

155

D300-3000

Recycling of wafers

6A9S

254

3-4

10+2

155

D300-400

Sapphire

 

 

Surface grinding of GaAs wafers.

Bond

Shape

D(mm)

X(mm)

U(mm)

L(mm)

H(mm)

Grit

Resin

6A9

150

3

8

20

M12

D400-D2000

 

 

Note: we can offer other specifications according to your drawing or sample.

Please indicate the following information when placing a new order.

1 specification

2 quantity

3 other requirements