Application: The dressing of polishing pad for semiconductor wafers.

Features

1. The single layer brazing technics grows the chemical bond between diamond and brazing metal to ensure that no diamond will be lost during working time.
2. High emergence and uniformity of diamond particles achieve high polishing removal rate.
3. Diamond with ordered array helps to get a stable wafer uniformity.
4. Qualified working life.
5. With good planeness.
6. No break in process needed, shorten downtime.

Standard specifications

Brazing and sketch of working

Note: we can offer other specifications according to your drawing or sample.

Please indicate the following information when placing a new order.

1 specification

2 quantity

3 other requirements