Diamond Thin Blades
Crystals
Semiconductor packages
Glass
Quartz
Sapphire
Printed circuit board
Ceramics
Description
Applications
Silicon Wafers
Crystals
Semiconductor packages
Glass
Quartz
Sapphire
Printed circuit board
Ceramics
Features
High cutting precision
High working efficiency
Lower heat-affected area
Low blade wear
Smooth and regular kerf
Standard specifications
|
Bond |
Shape Code |
O.D. mm |
I.D mm |
Thickness mm |
Thickness Tolerance mm |
Mesh Size |
Grit Size μm |
|
Resin Bond(RB) Metal Bond(MB) Nickel Bond(NB) |
1A8 1E8 1M8 1N8 1V8 |
Ø56 Ø75 Ø125 |
Ø40 Ø25.4 Ø31.75 |
0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 |
±0.003 ±0.005* ±0.01 |
D2000 D1500 D1200 D800 D600* D400* D300 D200* D170 D150* D120 |
5-10 8-15 10-20 20-30 30-40 36-54 50-65 65-85 75-97 90-116 107-139 |
Shapes of edge
Ordering Instruction
RB (no slot) is better for thin and brittle materials; MB (with 16-20 slots) is better for processing of thick and hard materials.
Please specify the O.D., I.D., thickness of blade and the size of diamond according to the condition of cutting when ordering. However, please ensure the thickness should be bigger than 3 times of diamond grit size.
The standard specifications have been shown in the table above.
* means which often be used for cutting process by our customers. Example: RB 1A8 Ø56x40Hx0.20T±0.005xD400
Dressing Board
CPdia prepared kinds of dressing board for your blades sharpening request.
Standard size:
75x75x1mm
80x80x1mm
Standard mesh:
#400、#600、#1200
Note: we can offer other specifications according to your drawing or sample.
Please indicate the following information when placing a new order.
1 specification
2 quantity
3 other requirements