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Diamond Thin Blades

Silicon Wafers
Crystals
Semiconductor packages
Glass
Quartz
Sapphire
Printed circuit board
Ceramics

Description


Applications

Silicon Wafers

Crystals

Semiconductor packages

Glass

Quartz

Sapphire

Printed circuit board

Ceramics

 

Features

High cutting precision

High working efficiency

Lower heat-affected area

Low blade wear

Smooth and regular kerf

 

Standard specifications

Bond

Shape Code

O.D.

mm

I.D

mm

Thickness

mm

Thickness Tolerance

mm

Mesh Size

Grit Size

μm

Resin Bond(RB)

Metal Bond(MB)

Nickel Bond(NB)

1A8

1E8

1M8

1N8

1V8

Ø56

Ø75

Ø125

Ø40

Ø25.4

Ø31.75

0.10

0.15

0.20

0.25

0.30

0.35

0.40

0.45

0.50

±0.003

±0.005*

±0.01

D2000

D1500

D1200

D800

D600*

D400*

D300

D200*

D170

D150*

D120

5-10

8-15

10-20

20-30

30-40

36-54

50-65

65-85

75-97

90-116

107-139

 

Shapes of edge





Ordering Instruction

RB (no slot) is better for thin and brittle materials; MB (with 16-20 slots) is better for processing of thick and hard materials.

Please specify the O.D., I.D., thickness of blade and the size of diamond according to the condition of cutting when ordering. However, please ensure the thickness should be bigger than 3 times of diamond grit size.

The standard specifications have been shown in the table above.

* means which often be used for cutting process by our customers. Example: RB 1A8 Ø56x40Hx0.20T±0.005xD400

 

Dressing Board

CPdia prepared kinds of dressing board for your blades sharpening request.

Standard size:

75x75x1mm

80x80x1mm

Standard mesh:

#400、#600、#1200





Note: we can offer other specifications according to your drawing or sample.

Please indicate the following information when placing a new order.

1 specification

2 quantity

3 other requirements